[原创] Intel MAX 10 FPGA系列低成本开发方案

Intel公司的MAX 10 FPGA系列采用TSMC 55nm NOR闪存技术,容量从2K到50K 逻辑单元(LE),采用单个或双核电源电压和小尺寸3x3mm和高I/O引脚数封装;器件具有全特性FPGA功能,支持Nios II软核嵌入处理器,数字信号处理(DSP)区块以及软DDR3存储器控制器,内部存储双配置闪存,用户闪存存储器,集成了模数转换器(ADC).主要用在系统管理,I/O扩展,通信控制,工业应用,汽车电子和消费类电子.本文介绍了Intel® MAX® 10 FPGA系列主要优势,器件平面布局图以及MAX 10 FPGA开发套件主要特性和电路图.

Intel® MAX® 10 FPGAs revolutionize non-volatile integration by delivering advanced processing capabilities in a low-cost, single chip small form factor programmable logic device. Building upon the single chip heritage of previous MAX device families, densities range from 2K – 50K LEs, using either single or dual-core voltage supplies. The MAX 10 FPGA family encompasses both advanced small wafer scale packaging (3 mm x 3 mm) and high I/O pin count packages offerings.
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