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[原创] TI MSP430FR604(3)xSoC超声波水流量检测参考设计TIDM-1019

关键词:RISC Architecture MCU SoC 测试测量 MSP430FR604x

时间:2020-03-13 13:16:59       来源:中电网

TI公司的 MSP430FR604x和MSP430FR603x系列是超声检测和测量系统级芯片(SoC),提供集成的超声波检测解决方案(USS)模块,为宽范围流速提供高精度的测量.USS模块由于最大化集成度而很少外部组件,因而把超低功耗的计量和低成本系统组合在一起.MSP430FR604x和MSP430FR603x MCU实现高速基于ADC的数字信号收集,采用集成的低能量加速度计(LEA)模块进行优化的信号处理,以得到高精度计量解决方案和电池供电的测量应用的超低功耗.USS模块包括可编程的脉冲发生器(PPG)和带低阻抗输出驱动器的物理接口(PHY),以及精确的阻抗匹配,以提供零流量漂移(ZFD).模块还包括可编程增益放大器(PGA),高速12位8Mbps sigma-delta ADC (SDHS),用来对工业标准超声传感器进行精确的信号收集.此外,MSP430FR604x和MSP430FR603x MCU还集成电其它外设,以改善计量系统集成度.器件具有计量测试接口(MTIF)模块,以实现脉冲发生.此外MCU还具有8复接器的LCD驱动器,RTC,12位SAR ADC,模拟比较器,高档加密加速度计(AES256)和循环冗余校验(CRC)模块.主要用在超声智能水表,超声智能热表,液为检测和漏水检测.中电网为您整理如下详细资料,本文介绍了MSP430FR604x系列主要特性,MSP430FR604(3)x系列功能框图,以及参考设计TIDM-1019主要特性和主要系统指标,框图,软件架构框图,电路图,材料清单和PCB设计图.

The Texas Instruments MSP430FR604x and MSP430FR603x family of ultrasonic sensing andmeasurement SoCs are powerful, highly integrated microcontrollers (MCUs) that are optimized for waterand heat meters. The MSP430FR604x MCUs offer an integrated Ultrasonic Sensing Solution (USS)module, which provides high accuracy for a wide range of flow rates. The USS module helps achieveultra-low-power metering combined with lower system cost due to maximum integration requiring very fewexternal components. MSP430FR604x and MSP430FR603x MCUs implement a high-speed ADC-basedsignal acquisition followed by optimized digital signal processing using the integrated Low-EnergyAccelerator (LEA) module to deliver a high-accuracy metering solution with ultra-low power optimum forbattery-powered metering applications.

The USS module includes a programmable pulse generator (PPG) and a physical interface (PHY) with alow-impedance output driver for optimum sensor excitation and accurate impendence matching to deliverbest results for zero-flow drift (ZFD). The module also includes a programmable gain amplifier (PGA) anda high-speed 12-bit 8-Msps sigma-delta ADC (SDHS) for accurate signal acquisition from industrystandard ultrasonic transducers.

Additionally, MSP430FR604x and MSP430FR603x MCUs integrate other peripherals to improve systemintegration for metering. The devices have a metering test interface (MTIF) module to implement pulsegeneration to indicate flow measured by the meter. The MSP430FR604x and MSP430FR603x MCUs alsohave an on-chip 8-mux LCD driver, an RTC, a 12-bit SAR ADC, an analog comparator, an advancedencryption accelerator (AES256), and a cyclic redundancy check (CRC) module.

MSP430FR604x and MSP430FR603x MCUs are supported by an extensive hardware and softwareecosystem with reference designs and code examples to get your design started quickly. Developmentkits include the MSP-TS430PZ100E 100-pin target development board and EVM430-FR6047 ultrasonicwater flow meter EVM. TI also provides free software including the ultrasonic sensing design center,ultrasonic sensing software library, and MSP430Ware™ software.

TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAMand a holistic ultra-low-power system architecture, letting system designers increase performance whilelowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, andendurance of RAM with the nonvolatility of flash.

MSP430FR604x系列主要特性:

• Best-in-Class Ultrasonic Water-Flow MeasurementWith Ultra-Low Power Consumption
– <25-ps Differential Time-of-Flight (dTOF)Accuracy
– High-Precision Time Measurement Resolution of<5 ps
– Ability to Detect Low Flow Rates (<1 Liter perHour)
– Approximately 3-μA Overall CurrentConsumption With One Measurement perSecond
• Compliant to and Exceeds ISO 4064, OIML R49,and EN 1434 Accuracy Standards
• Ability to Directly Interface Standard UltrasonicSensors (up to 2.5 MHz)
• Integrated Analog Front End – Ultrasonic SensingSolution (USS)
– Programmable Pulse Generation (PPG) toGenerate Pulses at Different Frequencies
– Integrated Physical Interface (PHY) With Low-Impedance (4-Ω) Output Driver to Control Inputand Output Channels
– High-Performance High-Speed 12-Bit Sigma-Delta ADC (SDHS) With Output Data Rates upto 8 Msps
– Programmable Gain Amplifier (PGA) With–6.5 dB to 30.8 dB
– High-Performance Phase-Locked Loop (PLL)With Output Range of 68 MHz to 80 MHz
• Metering Test Interface (MTIF)
– Pulse Generator and Pulse Counter
– Pulse Rates up to 1016 Pulses per Second (p/s)
– Count Capacity up to 65535 (16 Bit)
– Operates in LPM3.5 With 200 nA (Typical)
• Low-Energy Accelerator (LEA)
– Operation Independent of CPU
– 4KB of RAM Shared With CPU
– Efficient 256-Point Complex FFT:
Up to 40× Faster Than Arm® Cortex®-M0+ Core
• Embedded Microcontroller
– 16-Bit RISC Architecture up to 16‑MHz Clock
– Wide Supply Voltage Range From 3.6 V Downto 1.8 V (Minimum Supply Voltage is Restrictedby SVS Levels, See the SVS Specifications)
• Optimized Ultra-Low-Power Modes
– Active Mode: Approximately 120 μA/MHz
– Standby Mode With Real-Time Clock (RTC)(LPM3.5): 450 nA (1)
– Shutdown (LPM4.5): 30 nA
• Ferroelectric Random Access Memory (FRAM)
– Up to 256KB of Nonvolatile Memory
– Ultra-Low-Power Writes
– Fast Write at 125 ns Per Word (64KB in 4 ms)
– Unified Memory = Program + Data + Storage inOne Space
– 1015 Write Cycle Endurance
– Radiation Resistant and Nonmagnetic
• Intelligent Digital Peripherals
– 32-Bit Hardware Multiplier (MPY)
– 6-Channel Internal DMA
– RTC With Calendar and Alarm Functions
– Six 16-Bit Timers With up to SevenCapture/Compare Registers Each
– 32-Bit and 16-Bit Cyclic Redundancy Check(CRC)
• High-Performance Analog
– 16-Channel Analog Comparator
– 12-Bit SAR ADC Featuring Window Comparator,Internal Reference, and Sample-and-Hold, up to16 External Input Channels
– Integrated LCD Driver With Contrast Control forup to 264 Segments
• Multifunction Input/Output Ports
– Accessible Bit-, Byte-, and Word-Wise (in Pairs)
– Edge-Selectable Wake From LPM on All Ports
– Programmable Pullup and Pulldown on All Ports
• Code Security and Encryption
– 128- or 256-Bit AES Security Encryption andDecryption Coprocessor
– Random Number Seed for Random NumberGeneration Algorithms
– IP Encapsulation Protects Memory FromExternal Access
– FRAM Provides Inherent Security Advantages
• Enhanced Serial Communication
– Up to Four eUSCI_A Serial CommunicationPorts
– UART With Automatic Baud-Rate Detection
– IrDA Encode and Decode
– Up to Two eUSCI_B Serial CommunicationPorts
– I2C With Multiple-Slave Addressing
– Hardware UART or I2C Bootloader (BSL)
• Flexible Clock System
– Fixed-Frequency DCO With 10 SelectableFactory-Trimmed Frequencies
– Low-Power Low-Frequency Internal ClockSource (VLO)
– 32-kHz Crystals (LFXT)
– High-Frequency Crystals (HFXT)
• Development Tools and Software (Also See Toolsand Software)
– Ultrasonic Sensing Design Center GraphicalUser Interface
– Ultrasonic Sensing Software Library
– EVM430-FR6047 Water Meter EvaluationModule Board
– MSP-TS430PZ100E Target Socket Board for100-Pin Package
– Free Professional Development EnvironmentsWith EnergyTrace++ Technology
– MSP430Ware™ for MSP430™ Microcontrollers
• Device Comparison Summarizes the AvailableDevice Variants and Package Options
• For Complete Module Descriptions, See theMSP430FR58xx, MSP430FR59xx, and
MSP430FR6xx Family User ’ s Guide

MSP430FR604x系列应用:

• Ultrasonic Smart Water Meters
• Ultrasonic Smart Heat Meters
• Liquid Level Sensing
• Water Leak Detection

图1.MSP430FR604x系列功能框图

图2.MSP430FR603x系列功能框图

水流测量的超声波检测子系统参考设计TIDM-1019

This reference design helps designers develop anultrasonic water-metering subsystem using anintegrated, ultrasonic sensing solution (USS) module,which provides superior metrology performance, withlow-power consumption and maximum integration.

Thedesign is based on the 256KB MSP430FR6047microcontroller (MCU), with integrated high-speed,ADC-based, signal acquisition and an integrated lowenergyaccelerator (LEA) to optimize digital signalprocessing.

The TIDM-1019 device was built using the MSP430FR6047 MCU from TI and other discrete components.

The implementation is based on the calculation of differential time of flight (ToF), involving two transducersfor upstream and downstream paths. Transducer excitation and signal captures are implemented usingthe internal, ultrasonic sensing solution (USS) module of the MSP430FR6047 MCU. The signal is thenpassed through a series of algorithms using the LEA of the MSP430™ MCU, to calculate the necessaryoutput data in a quick and power-effective manner.

The TIDM-1019 device uses the EVM430-FR6047 evaluation kit, targeted specifically for ultrasonicsensing applications like water-flow meters. The EVM includes a connector to interface with otherBoosterPack™ plug-in modules. The reference design includes all the hardware files required.

The software is written in a modular and portable manner by using MSP430Ware™ software andMSP430’s Ultrasonic Sensing Water Metering Library from TI.

The reference design also includes the Ultrasonic Design Center, which enables designers to modify andoptimize different configuration parameters through an easy-to-use GUI. The USS Design Center letsusers implement and customize different transceivers easily without modifying the application code in theexample project.

The design files include source code for an application example and corresponding Code ComposerStudio™ (CCS) and IAR Embedded Workbench™projects.

参考设计TIDM-1019主要特性:

• Best-In-Class Metrology Performance: 25-ps Zero-Flow Drift (ZFD) and 32-ps Single-Shot StandardDeviation
• Low-Power Consumption: Approximately 2.5 μAWith 1-MHz Transducer at 1 Measurement perSecond For Metrology
• Flexibility to Test Different Pipes and Transducers;Direct Interface to Pair of Transducers
• Easy to Test and Customize Using UltrasonicSensing Design Center Graphical User Interface(GUI)
• Ultrasonic Sensing Software Library Includes Timeof Flight (ToF) Algorithms
• Stand-Alone Demo Using Liquid-Crystal Display(LCD)

参考设计TIDM-1019应用:

• Water Meter
• Heat Meter
• Flow Transmitter

图3.MSP430FR604x系列 MCU超声检测EVM EVM430-FR6047外形图

图4.参考设计TIDM-1019框图

图5.参考设计TIDM-1019软件架构框图
参考设计TIDM-1019主要系统指标:


图6.EVM430-FR6047连接水表固定连接图

图7.参考设计TIDM-1019电路图(1)

图8.参考设计TIDM-1019电路图(2)

图9.参考设计TIDM-1019电路图(3)

图10.参考设计TIDM-1019电路图(4)

图11.参考设计TIDM-1019电路图(5)
参考设计TIDM-1019材料清单:





图12.参考设计TIDM-1019 PCB设计图(1)

图13.参考设计TIDM-1019 PCB设计图(2)

图14.参考设计TIDM-1019 PCB设计图(3)

图15.参考设计TIDM-1019 PCB设计图(4)

图16.参考设计TIDM-1019 PCB设计图(5)

图17.参考设计TIDM-1019 PCB设计图(6)

图18.参考设计TIDM-1019 PCB设计图(7)

图19.参考设计TIDM-1019 PCB设计图(8)
中电网为您整理如下详细资料详情请见:
http://www.ti.com/lit/ds/slaseb7c/slaseb7c.pdf
http://www.ti.com/lit/ug/tidudn0/tidudn0.pdf
以及http://www.ti.com/lit/df/tidrw71a/tidrw71a.pdf
http://www.ti.com/lit/df/tidrw72/tidrw72.pdf
tidrw72.pdf
tidrw71a.pdf
slaseb7c.pdf
tidudn0.pdf

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