[原创] On Semi RSL10多协议无线系统级芯片(SoC)开发方案

On Semi公司的RSL10是超低功耗的多协议无线系统级芯片(SoC),采用ARMR CortexR−M3处理器(48MHz)和LPDSP32 DSP核(音频CODEC),支持蓝牙5.0低功耗技术和2.4GHz多协议堆栈,Rx接收灵敏度-94dBm,数据速率62.5-2000kbps,发送功率-17到+6dBm,工作电压1.1-3.3V,主要用在可穿戴,物联网(IoT),无线使能低压设备和汽车电子.本文介绍了RSL10主要特性,框图和架构图,应用电路图,以及IoT IDK BLERSL10评估板BLE-IOT-GEVB主要特性,电路图,材料清单和PCB设计图.

RSL10 is an ultra−low−power, highly flexible multi−protocol2.4 GHz radio specifically designed for use in high−performancewearable and medical applications. With its ARMR CortexR−M3Processor and LPDSP32 DSP core, RSL10 supports Bluetooth lowenergy technology and 2.4 GHz proprietary protocol stacks, withoutsacrificing power consumption.

RSL10主要特性:

• Rx Sensitivity (Bluetooth Low Energy Mode, 1 Mbps): −94 dBm
• Data Rate: 62.5 to 2000 kbps
• Transmitting Power: −17 to +6 dBm
• Peak Rx Current = 5.6 mA (1.25 V VBAT)
• Peak Rx Current = 3.0 mA (3 V VBAT)
• Peak Tx Current (0 dBm) = 8.9 mA (1.25 V VBAT)
• Peak Tx Current (0 dBm) = 4.6 mA (3 V VBAT)
• Bluetooth 5 Certified with LE 2M PHY Support..

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