Cypress CYW20706蓝牙4．1兼容嵌入SoC开发方案

Cypress公司的CYW20706是单片蓝牙4.1兼容嵌入系统级(SoC)芯片,具有基带处理器,2.4GHz收发器,ARM Cortex M3 MCU,ROM和RAM以及集成的蓝牙堆栈.采用40nm CMOS低功耗工艺,具有高集成度和降低外接元件.ARM MCU工作频率高达96MHz,集成的功率放大器输出功率高达+12dBm,集成的外设包括PWM,ADC和TRIAC控制,主要用在家庭自动化,POS输入设备,血压监视器,心率监视器,接近传感器,温度计和可穿戴设备.本文介绍了CYW20706主要特性和功能框图,以及评估板CYW920706WCDEVAL特性,框图和蔼电路图与PCB元件布局图.
The Cypress CYW20706 is a single-chip Bluetooth 4.1-compliant, embedded SoC with an integrated baseband processor, a 2.4 GHztransceiver, an ARM Cortex M3, ROM and RAM, as well as an integrated Bluetooth stack. Manufactured using an advanced 40 nm　CMOS low-power process, the CYW20706 employs high levels of integration reduce external components, thereby minimizing thedevice’s footprint and the costs associated with implementing Bluetooth solutions.
The CYW20706 is the optimal solution for embedded and IoT applications. Built-in ROM firmware provides access to both BluetoothLow Energy (SMART) and Bluetooth Classic (SMART READY).
The CYW20706 microprocessor unit (MPU) runs software from the link control (LC) layer up to the host controller interface (HCI). Inaddition, the MPU supports the running of application layer code that interfaces to the HCI layer. The microprocessor is based on the　Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The microprocessor also includes 848 KBof ROM memory for boot ROM and 352 KB of RAM for data scratch-pad, patch RAM code, and application code.
The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations. Atpower-up, the lower layer protocol stack is executed from the internal ROM.
External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patchescan be downloaded using external NVRAM. The device can...