[原创] ADI SSM6322高保真低功耗立体声音频放大器解决方案

ADI公司的SSM6322是高保真低功耗立体声音频放大器,可直接和音频DAC/CODEC接口,具有杰出的音频性能和最小化功耗,从而延长手持设备电池寿命.1kHz时的THD+N为-121dB,输出电流100 mA rms,电源电压±3.3 V到±6 V,4 mm × 4 mm LFCSP封装,主要用在高保真耳机驱动器,手机,蓝牙扬声器和耳机,笔记本电脑和平板电脑A/V接收器,汽车娱乐系统.本文介绍了SSM6322主要特性,功能框图,以及评估板SSM6322CP-EBZ主要特性,电路图,材料清单和PCB设计图.

The SSM6322 is an integrated, dual-channel audio amplifiersolution that interfaces directly with audio DAC/CODEC,maximizing the fidelity of high fidelity audio signal chains. Thehighly efficient design of the SSM6322 delivers outstandingaudio performance while minimizing power dissipation formaximum battery life in portable applications.

The SSM6322 features −121 dB THD + N at 1 kHz, alongwith very low output noise from 20 Hz to 20 kHz. The low poweroperation, high peak output current, and high PSRR make theSSM6322 an ideal candidate for applications that require highfidelity audio, high dynamic range, precision, and low power. Thishighly integrated drive solution also reduces development timewhile reducing board space and minimizing external components.

The SSM6322 is available in a 24-lead LFCSP package. TheSSM6322 operates over the industrial temperature of −40°C to+85°C.

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