Freescale Kinetis KL03 CSP MCU开发方案

Freescale公司的Kinetis KL03芯片尺寸封装(CSP) MCU是业界最小的基于ARM Cortex－M0+的MCU,尺寸为1.6x2.0mm,能节省PCB面积35%,而比同类产品GPIO多60%,工作频率48MHz,多达32KB闪存,2KB SRAM和8 KB ROM,主要用在消费电子的遥控,智能监视器,智能手表,运动穿戴电子以及无线传感器网络.本文介绍了Kinetis KL03主要特性, 功能框图以及评估板FRDM-KL03Z主要特性,电路图和材料清单.

The Kinetis KL03 chip-scale package (CSP) MCU is the next world’s smallest ARM Powered® MCU designed to support the latest innovation in smart, small devices. Available in the ultra-small 1.6 x 2.0 mm² wafer-level CSP, the Kinetis KL03 CSP (MKL03Z32CAF4R) reduces even more board space while integrating even more rich MCU features than previously seen in the market. The Kinetis KL03 CSP MCU consumes 35 percent less PCB area, yet delivers 60 percent more GPIO than the nearest competing MCU. The Kinetis KL03 family joins the Freescale Kinetis mini MCU portfolio, allowing designers to dramatically reduce their board size without compromising the performance, feature integration and power consumption of their end products.
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