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[原创] Renesas RA6M1 120MHz 32位ARM MCU开发方案

关键词:Arm Cortex-M4 MCU RA6M1微控制器

时间:2020-02-11 11:49:56       来源:中电网

Renesas公司的RA6M1微控制器是瑞萨电子 RA6 产品系列的切入点,采用高效的 40nm 工艺,由开放且灵活的生态系统概念提供支持,即基于 FreeRTOS 的灵活配置软件包 (FSP),能够扩展以使用其他 RTOSes 和中间件. RA6M1具有120MHz 32位Arm® Cortex®-M4 内核,集成了512kB 闪存以及 256kB SRAM,以及与 EEPROM 存储数据功能类似的 8kB 数据闪存.具有电容式触摸传感单元,全速 USB 2.0,CAN 2.0B,SCI(UART,简单 SPI,简单 I2C),SPI/ I2C 多主机接口,SDHI和SSI/串行声音接口.适用于需要安全性,大型嵌入式 RAM 和低功耗的物联网应用如安全性(火灾探测,防盗检测,面板控制),计量(电力,自动抄表),工业(机器人,开门器,缝纫机,自动售货机,UPS)以及HVAC(供暖,空调,锅炉控制)和一般用途等.本文介绍了RA6M1主要特性,框图,以及评估板EK-RA6M1 v1主要特性,框图,电路图,材料清单和PCB设计图.

The MCU integrates multiple series of software- and pin-compatible Arm®-based 32-bit cores that share a common set of Renesas peripherals to facilitate design scalability and efficient platform-based product development.

The MCU in this series incorporates a high-performance Arm Cortex®-M4 core running up to 120 MHz with the following features:

 512-KB code flash memory
 256-KB SRAM
 Capacitive Touch Sensing Unit (CTSU)
 USBFS
 SD/MMC Host Interface
 Quad Serial Peripheral Interface (QSPI)
 Security and safety features
 12-bit A/D Converter (ADC12)
 12-bit D/A Converter (DAC12)
 Analog peripherals.

RA6M1主要特性:

■ Arm Cortex-M4 Core with Floating Point Unit (FPU)
 Armv7E-M architecture with DSP instruction set
 Maximum operating frequency: 120 MHz
 Support for 4-GB address space
 On-chip debugging system: JTAG, SWD, and ETM
 Boundary scan and Arm Memory Protection Unit (Arm MPU)
■ Memory
 512-KB code flash memory (40 MHz zero wait states)
 8-KB data flash memory (125,000 erase/write cycles)
 256-KB SRAM
 Flash Cache (FCACHE)
 Memory Protection Units (MPU)
 Memory Mirror Function (MMF)
 128-bit unique ID
■ Connectivity
 USB 2.0 Full-Speed (USBFS) module
- On-chip transceiver
 Serial Communications Interface (SCI) with FIFO × 7
 Serial Peripheral Interface (SPI) × 2
 I2C bus interface (IIC) × 2
 CAN module (CAN) × 2
 Serial Sound Interface Enhanced (SSIE)
 SD/MMC Host Interface (SDHI) × 2
 Quad Serial Peripheral Interface (QSPI)
 IrDA interface
 Sampling Rate Converter (SRC)
 External address space
- 8-bit bus space
■ Analog
 12-bit A/D Converter (ADC12) with 3 sample-and-hold circuits each × 2
 12-bit D/A Converter (DAC12) × 2
 High-Speed Analog Comparator (ACMPHS) × 6
 Programmable Gain Amplifier (PGA) × 6
 Temperature Sensor (TSN)
■ Timers
 General PWM Timer 32-bit Enhanced High Resolution (GPT32EH) × 4
 General PWM Timer 32-bit Enhanced (GPT32E) × 4
 General PWM Timer 32-bit (GPT32) × 5
 Asynchronous General-Purpose Timer (AGT) × 2
 Watchdog Timer (WDT)
■ Safety
 Error Code Correction (ECC) in SRAM
 SRAM parity error check
 Flash area protection
 ADC self-diagnosis function
 Clock Frequency Accuracy Measurement Circuit (CAC)
 Cyclic Redundancy Check (CRC) calculator
 Data Operation Circuit (DOC)
 Port Output Enable for GPT (POEG)
 Independent Watchdog Timer (IWDT)
 GPIO readback level detection
 Register write protection
 Main oscillator stop detection
 Illegal memory access
■ System and Power Management
 Low power modes
 Realtime Clock (RTC) with calendar and VBATT support
 Event Link Controller (ELC)
 DMA Controller (DMAC) × 8
 Data Transfer Controller (DTC)
 Key Interrupt Function (KINT)
 Power-on reset
 Low Voltage Detection (LVD) with voltage settings
■ Security and Encryption
 AES128/192/256
 3DES/ARC4
 SHA1/SHA224/SHA256/MD5
 GHASH
 RSA/DSA/ECC
 True Random Number Generator (TRNG)
■ Human Machine Interface (HMI)
 Capacitive Touch Sensing Unit (CTSU)
■ Multiple Clock Sources
 Main clock oscillator (MOSC) (8 to 24 MHz)
 Sub-clock oscillator (SOSC) (32.768 kHz)
 High-speed on-chip oscillator (HOCO) (16/18/20 MHz)
 Middle-speed on-chip oscillator (MOCO) (8 MHz)
 Low-speed on-chip oscillator (LOCO) (32.768 kHz)
 IWDT-dedicated on-chip oscillator (15 kHz)
 Clock trim function for HOCO/MOCO/LOCO
 Clock out support
■ General-Purpose I/O Ports
 Up to 76 input/output pins
- Up to 9 CMOS input
- Up to 67 CMOS input/output
- Up to 14 input/output 5 V tolerant
- Up to 13 high current (20 mA)
■ Operating Voltage
 VCC: 2.7 to 3.6 V
■ Operating Temperature and Packages
 Ta = -40°C to +85°C
- 100-pin LGA (7 mm × 7 mm, 0.65 mm pitch)
 Ta = -40°C to +105°C
- 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch)
- 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch)
- 64-pin QFN (8 mm × 8 mm, 0.4 mm pitch)

图1. RA6M1框图

评估板EK-RA6M1 v1

 Evaluation Kit for RA6M1 Microcontroller Group EK-RA6M1 v1
The EK-RA6M1 v1 enables developers to get started with initial firmware development.
• Renesas RA6M1 Microcontroller Group
 R7FA6M1AD3CFP
 100-pin LQFP package
 120 MHz Arm® Cortex®-M4 core with Floating Point Unit (FPU)
 256 KB SRAM
 512 KB code flash memory
 8 KB data flash memory
• Connectivity
 A Device USB connector for the Main MCU
 S124 MCU-based SEGGER J-Link® On-Board interface for debugging and programming of the RA6M1 MCU. A 10-pin JTAG/SWD interface is also provided for connecting optional external debuggers and programmers.
 Two PMOD connectors, allowing use of appropriate PMOD compliant peripheral plug-in modules for rapid prototyping
 Pin headers for access to power and signals for the Main MCU
• Multiple clock sources
 Main MCU oscillator crystals, providing precision 12.000 MHz and 32,768 Hz external reference clocks  Additional low-precision clocks are available internal to the Main MCU
• MCU reset push-button switch
• MCU boot configuration jumper
• General purpose I/O ports
 One jumper to allow measuring of Main MCU current
 Copper jumpers on PCB bottom side for configuration and access to selected MCU signals
• Operating voltage
 External 5 V input through the Debug USB connector supplies the on-board power regulator to power logic and interfaces on the board. External 5 V or 3.3 V may be also supplied through alternate locations on the board.
• A two-color board status LED indicating availability of regulated power and connection status of the J-Link interface
• A red User LED, controlled by the Main MCU firmware
• A User Push-Button switch, User Capacitive Touch Button sensor, and an optional User Potentiometer, all of which are controlled by the Main MCU firmware

图2. 评估板EK-RA6M1 v1外形图:顶视图

图3. 评估板EK-RA6M1 v1外形图:底视图

图4. 评估板EK-RA6M1 v1框图

图5.电源选择图

图6. 评估板EK-RA6M1 v1电路图(1)

图7. 评估板EK-RA6M1 v1电路图(2)

图8. 评估板EK-RA6M1 v1电路图(3)

图9. 评估板EK-RA6M1 v1电路图(4)
评估板EK-RA6M1 v1材料清单:


图10. 评估板EK-RA6M1 v1 PCB设计图:PCB尺寸图

图11. 评估板EK-RA6M1 v1 PCB设计图(1)

图12. 评估板EK-RA6M1 v1 PCB设计图(2)
详情请见:
https://www2.renesas.cn/cn/zh/doc/products/mpumcu/doc/ra/001/r01ds0356ej0100-ra6m1.pdf
https://www2.renesas.cn/cn/zh/doc/products/mpumcu/doc/ra/001/r20ut4577eu0100-ek-ra6m1-v1-um.pdf
ek-ra6m1-v1-bom.PDF
r01ds0356ej0100-ra6m1.pdf
ek-ra6m1-v1-schematics.pdf
r20ut4577eu0100-ek-ra6m1-v1-um.pdf

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