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[原创] TI MSP430FR2355超低功耗 FRAM MCU开发方案

关键词:FRAM MCU 传感器 烟雾和热检测 电池组

时间:2020-02-03 17:05:18       来源:中电网

TI公司的MSP430FR2355是超低功耗MSP430FRx系列基于FRAM的微控制器(MCU),提供扩展的数据记录和安全功能,在FRAM微控制器系列产品中采用小型LQFP封装(7mm × 7 mm),集成了各种外设和超低功耗. FRAM(铁电存储器)是一种尖端的存储技术,在非易失存储器中集合了闪存和RAM的最好特性. MSP430FR2355工作电压1.8V-3.6V,具有16位RISC架构,高达24MHz系统时钟和8MHz FRAM接入,32KB可编FRAM,512B信息FRAM和4KB RAM,12路12位ADC,两个增强的比较器和集成的6位DAC作为基准电压,四个智能模拟组合体(SAC-L3),三个16位计时器有三个捕获/比较寄存器(Timer_B3),一个16位计时器有七个捕获/比较寄存器(Timer_B7),32位硬件乘法器(MPY).器件的工作温度–40° 到105°C,主要用在烟雾和热检测器,传感器发送器,电路中断器,传感器信号调理,有线工业通信,光模块以及其电池组管理和收费标签.本文介绍了MSP430FR2355主要特性,功能框图以及开发板MSP‑EXP430FR2355 LaunchPad™主要特性,框图,电路图,材料清单和PCB设计图.

MSP430FR215x and MSP430FR235x microcontrollers (MCUs) are part of the MSP430™ MCU value line portfolio of ultra-low-power low-cost devices for sensing and measurement applications. MSP430FR235x MCUs integrate four configurable signal-chain modules called smart analog combos, each of which can be used as a 12-bit DAC or a configurable programmable-gain Op-Amp to meet the specific needs of a system while reducing the BOM and PCB size. The device also includes a 12-bit SAR ADC and two comparators. The MSP430FR215x and MSP430FR235x MCUs all support an extended temperature range from –40° up to 105°C, so higher temperature industrial applications can benefit from the devices’FRAM data-logging capabilities. The extended temperature range allows developers to meet requirements of applications such as smoke detectors, sensor transmitters, and circuit breakers.

The MSP430FR215x and MSP430FR235x MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode typically in less than 10 μs.

The MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.

MSP430FR215x and MSP430FR235x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP-EXP430FR2355 LaunchPad™ development kit and the MSP-TS430PT48 48-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ community forum.

MSP430FR2355主要特性:

• Embedded microcontroller
– 16-bit RISC architecture up to 24 MHz
– Extended temperature: –40°C to 105°C
– Wide supply voltage range from 3.6 V down to 1.8 V (operational voltage is restricted by SVS levels, see VSVSH- and VSVSH+ in PMM, SVS and BOR)
• Optimized low-power modes (at 3 V)
– Active mode: 142 μA/MHz
– Standby:
– LPM3 with 32768-Hz crystal: 1.43 μA (with SVS enabled)
– LPM3.5 with 32768-Hz crystal: 620 nA (with SVS enabled)
– Shutdown (LPM4.5): 42 nA (with SVS disabled)
• Low-power ferroelectric RAM (FRAM)
– Up to 32KB of nonvolatile memory
– Built-in error correction code (ECC)
– Configurable write protection
– Unified memory of program, constants, and storage
– 1015 write cycle endurance
– Radiation resistant and nonmagnetic
• Ease of use
– 20KB ROM library includes driver libraries and FFT libraries
• High-performance analog
– One 12-channel 12-bit analog-to-digital converter (ADC)
– Internal shared reference (1.5, 2.0, or 2.5 V)
– Sample-and-hold 200 ksps
– Two enhanced comparators (eCOMP)
– Integrated 6-bit digital-to-analog converter (DAC) as reference voltage
– Programmable hysteresis
– Configurable high-power and low-power modes
– One with fast 100-ns response time
– One with 1-μs response time with 1.5-μA low power
– Four smart analog combo (SAC-L3) (MSP430FR235x devices only)
– Supports General-Purpose Operational Amplifier (OA)
– Rail-to-rail input and output
– Multiple input selections
– Configurable high-power and low-power modes
– Configurable PGA mode supports
– Noninverting mode: ×1, ×2, ×3, ×5, ×9, ×17, ×26, ×33
– Inverting mode: ×1, ×2, ×4, ×8, ×16, ×25, ×32
– Built-in 12-bit reference DAC for offset and bias settings
– 12-bit voltage DAC mode with optional references
• Intelligent digital peripherals
– Three 16-bit timers with three capture/compare registers each (Timer_B3)
– One 16-bit timer with seven capture/compare registers each (Timer_B7)
– One 16-bit counter-only real-time clock counter (RTC)
– 16-bit cyclic redundancy checker (CRC)
– Interrupt compare controller (ICC) enabling nested hardware interrupts
– 32-bit hardware multiplier (MPY32)
– Manchester codec (MFM)
• Enhanced serial communications
– Two enhanced USCI_A (eUSCI_A) modules support UART, IrDA, and SPI
– Two enhanced USCI_B (eUSCI_B) modules support SPI and I2C
• Clock system (CS)
– On-chip 32-kHz RC oscillator (REFO)
– On-chip 24-MHz digitally controlled oscillator (DCO) with frequency locked loop (FLL)
– ±1% accuracy with on-chip reference at room temperature
– On-chip very low-frequency 10-kHz oscillator (VLO)
– On-chip high-frequency modulation oscillator (MODOSC)
– External 32-kHz crystal oscillator (LFXT)
– External high-frequency crystal oscillator up to 24 MHz (HFXT)
– Programmable MCLK prescaler of 1 to 128
– SMCLK derived from MCLK with programmable prescaler of 1, 2, 4, or 8
• General input/output and pin functionality
– 44 I/Os on 48-pin package
– 32 interrupt pins (P1, P2, P3, and P4) can wake MCU from LPMs
• Development tools and software (also see Tools and Software)
– LaunchPad™ development kit (MSP‑EXP430FR2355)
– Target development board (MSP‑TS43048PT)
– Free professional development environments
• Family members (also see Device Comparison)
– MSP430FR2355: 32KB of program FRAM, 512 bytes of data FRAM, 4KB of RAM
– MSP430FR2353: 16KB of program FRAM, 512 bytes of data FRAM, 2KB of RAM
– MSP430FR2155: 32KB of program FRAM,  12 bytes of data FRAM, 4KB of RAM
– MSP430FR2153: 16KB of program FRAM, 512 bytes of data FRAM, 2KB of RAM
• Package options
– 48-pin: LQFP (PT)
– 40-pin: VQFN (RHA)
– 38-pin: TSSOP (DBT)
– 32-pin: VQFN (RSM)

MSP430FR2355应用:

• Smoke and heat detectors
• Sensor transmitters
• Circuit breakers
• Sensor signal conditioning
• Wired industrial communications
• Optical modules
• Battery pack management
• Toll tags

图1. MSP430FR235x系列功能框图

开发板MSP‑EXP430FR2355 LaunchPad™

MSP430FR2355 LaunchPad™ Development Kit (MSP‑EXP430FR2355)

The MSP-EXP430FR2355 LaunchPad™ Development Kit is an easy-to-use Evaluation Module (EVM) for the MSP430FR2355 microcontroller (MCU). The kit contains everything needed to start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming, debugging, and energy measurements. The board also features onboard buttons and LEDs for quick integration of a simple user interface, an onboard Grove connector for external Grove sensors, as well as an ambient light sensor to showcase the integrated analog peripherals.

The 24-MHz MSP430FR2355 device features 32KB of embedded FRAM (ferroelectric random access memory), a nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. Combined with 4KB of on-chip RAM, users have access to 32KB of memory to split between their program and data as required. For example, a data logging application may require a large data memory with relatively small program memory, so the memory may be allocated as required between program and data memory.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers.

开发板MSP‑EXP430FR2355 LaunchPad™主要特性:

• MSP ULP FRAM technology based MSP430FR2355 16-bit MCU
• EnergyTrace technology available for ultra-low-power debugging
• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
• Onboard eZ-FET debug probe
• 2 buttons and 2 LEDs for user interaction
• Ambient light sensor for the Out-of-Box Experience demo
• Grove connector for external Grove sensors
开发板MSP‑EXP430FR2355 LaunchPad™包括:
• 1 MSP-EXP430FR2355 LaunchPad Development Kit
• 1 Micro USB cable
• 1 Quick Start Guide

图2. 开发板MSP‑EXP430FR2355 LaunchPad™外形图

图3. 开发板MSP‑EXP430FR2355 LaunchPad™概述图

图4. 开发板MSP‑EXP430FR2355 LaunchPad™框图

图5. 开发板MSP‑EXP430FR2355 LaunchPad™电路图(1)

图6. 开发板MSP‑EXP430FR2355 LaunchPad™电路图(2)

图7. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(1)

图8. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(2)

图9. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(3)

图10. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(4)

图11. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(5)

图12. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(6)

图13. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(7)

图14. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(8)

图15. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(9)

图16. 开发板MSP‑EXP430FR2355 LaunchPad™ PCB设计图(10)
开发板材料清单见:
MCU036A(001)_BOM.xls
详情请见:
https://www.ti.com/lit/ds/slasec4c/slasec4c.pdf
https://www.ti.com/lit/ug/slau680/slau680.pdf
slasec4c.pdf
slau680.pdf

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