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[原创] TI MSP432P411x+MSP432P401x无线监视参考设计TIDA-010012

关键词:Arm 32-bit Cortex-M4F MCU Wi-Fi 蓝牙低功耗(BLE)

时间:2019-10-31 11:38:44       来源:中电网

TI公司的MSP432P411x+MSP432P401x是SimpleLink MCU平台一部分,包括Wi-Fi,蓝牙低功耗(BLE),<1GHz和主MCU.MSP432P411x和MSP432P401x MCU由完整的生态系统工具,软件,文件,培训所支持,以很快进行开发.LaunchPad™开发板或MSP-TS432PZ100目标板以及不受限制的SimpleLink MSP432 SDK能帮助进行开发.MSP432P411x和MSP432P401x MCU内核是带浮点单元和存储器保护单元的Arm® 32-bit Cortex®-M4F CPU,工作频率高达48MHz,ULP基准,150.6 ULPBench™-CP性能基准,3.41 CoreMark/MHz和1.22 DMIPS/MHz (Dhrystone 2.1).具有线进的低功耗模拟特性,包括16位精度和高达1Msps的SAR ADC,差分和单端输入,两个窗口比较器,多达24和输入通路,内部基准电压具有25-ppm/℃稳定性,两个模拟比较器.器件还集成了LCD驱动器,具有对比度控制和高达320段.工作电压1.62 V 到 3.7 V,工作温度–40℃ 到 85℃.主要用在仪器仪表,建筑物自动化,工厂自动化,健康和健身.本文介绍了MSP432P411x和MSP432P401x系列主要特性,功能框图以及参考设计TIDA-010012主要特性,主要系统指标框图和Wi-Fi和显示模块框图,电路图,材料清单和PCB设计图.

TI Designs:TIDA-010012IndustrialWirelessConditionMonitoringReferenceDesign
The SimpleLink MSP432P411x and MSP432P401x microcontrollers (MCUs) are optimized wireless hostMCUs with an integrated 16-bit precision ADC, delivering ultra-low-power performance including 100μA/MHz in active power and 820 nA in standby power with FPU and DSP extensions. As an optimizedwireless host MCU, the MSP432P411x and MSP432P401x let developers add high-precision analog andmemory extension to applications based on SimpleLink wireless connectivity solutions.

The MSP432P411x and MSP432P401x devices are part of the SimpleLink MCU platform, which consistsof Wi-Fi, Bluetooth low energy, Sub-1 GHz, and host MCUs. All share a common, easy-to-usedevelopment environment with one core software development kit (SDK) and a rich tool set. A one-timeintegration of the SimpleLink platform lets you add any combination of devices from the portfolio into yourdesign. The ultimate goal of the SimpleLink platform is to achieve 100 percent code reuse when yourdesign requirements change. For more information, visit www.ti.com/simplelink.

MSP432P411x and MSP432P401x MCUs are supported by a comprehensive ecosystem of tools,software, documentation, training, and support to get your development started quickly. The LaunchPad™development kit or MSP-TS432PZ100 target socket board (with additional MCU sample) along with thefree SimpleLink MSP432 SDK are all you need to get started.

MSP432P411x系列主要特性:

• Core
– Arm® 32-bit Cortex®-M4F CPU with floatingpoint unit and memory protection unit
frequency up to 48 MHz
– ULP benchmark
– 150.6 ULPBench™-CPPerformance benchmark
– 3.41 CoreMark/MHz
– 1.22 DMIPS/MHz (Dhrystone 2.1)
• Advanced low-power analog features
– SAR analog-to-digital converter(ADC)with 16-bit precision and up to 1 Msps
– Differential and single-ended inputs
– Two window comparators
– Up to 24 input channels
– Internal voltage reference with 25-ppm/°Ctypical stability
– Two analog comparators
– Integrated LCD driver with contrast control forup to 320 segments
• Memories
– Up to 2048KB of flash main memory (organizedinto two banks enabling simultaneous read orexecute during erase)
– 32KB of flash information memory (includingarea used for BSL, TLV, and flash mailbox)
– Up to 256KB of SRAM (including 8KB of backupmemory)
– 2KB of utility SRAM
– 32KB of ROM with MSP432™ peripheral driverlibraries
• Ultra-low-power operating modes
– Active: 100 μA/MHz
– Low-frequency active: 95 μA (at 128 kHz)
– LPM3 (With RTC): 820 nA
– LPM3.5 (With RTC): 820 nA
– LPM4: 690 nA
– LPM4.5: 22 nA
• SimpleLink™ platform
– Support for Bluetooth® low energy, Wi-Fi®, andSub-1 GHz
– Single development environment
– 100% code reuse across SimpleLink SDK
• Operating characteristics
– Wide supply voltage range: 1.62 V to 3.7 V
– Temperature range (ambient): –40℃ to 85℃
• Flexible clocking features
– Programmable internal DCO (up to 48 MHz)
– 32.768-kHz low-frequency crystal (LFXT)
– High-frequency crystal (HFXT) up to 48 MHz
– Low-frequency trimmed internal referenceoscillator (REFO)
– Very-low-power low-frequency internal oscillator(VLO)
– Module oscillator (MODOSC)
– System oscillator (SYSOSC)
• Code security features
– JTAG and SWD lock
– IP protection (up to four secure flash zones,each with configurable start address and size)
• Enhanced system options
– Programmable supervision and monitoring ofsupply voltage
– Multiple-class resets for better control ofapplication and debug
– 8-channel DMA
– RTC with calendar and alarm functions
• Timing and control
– Up to four 16-bit timers, each with up to fivecapture, compare, pwm capability
– Two 32-bit timers with interrupt generationcapability
• Serial communication
– Up to four eUSCI_A modules
– UART with automatic baud-rate detection
– IrDA encode and decode
– SPI (up to 16 Mbps)
– Up to four eUSCI_B Modules
– I2C (with multiple-slave addressing)
– SPI (up to 16 Mbps)
• Flexible I/O features
– Ultra-low-leakage I/Os (±20 nA maximum)
– All I/Os with capacitive touch capability
– Up to 48 I/Os with interrupt and wake-upcapability
– Up to 24 I/Os with port mapping capability
– Eight I/Os with glitch filtering capability
• Encryption and data integrity accelerators
– 128-, 192-, or 256-bit AES encryption anddecryption accelerator
– 32-bit hardware CRC engine
• JTAG and debug support
– 4-pin JTAG and 2-pin SWD debug interfaces
– Serial wire trace
– Power debug and profiling of applications

MSP432P411x系列应用:

• Metering
– Flow meter
– Electric meters
– Fault detectors
– Field transmitters
• Building automation
– Thermostat
– Security systems
– Smoke detectors
– Access panels
• Factory automation
– Wireless power monitor
– Predictive failure sensors
– Field transmitter
– Foundational field bus
• Health and fitness
– Health monitors
– Fitness accessories
– Blood glucose meters

图1.MSP432P411x系列功能框图

图2.MSP432P401x系列功能框图

参考设计TIDA-010012

Use this reference design to quickly establish awireless network that connects various types ofsensors for condition monitoring directly to the Cloud.Condition Monitoring is based on a regular orpermanent recording of the machine condition which isnecessary for predictive maintenance. Inputs such asRS-232, RS-485, IO-Link or resistance temperaturedetectors (RTDs) are included in the design to monitor different sensors and machines.

Condition monitoring is used to monitor the condition of machines and systems in a wide variety ofapplication areas. Compared to the frequently used preventive maintenance, Condition Monitoring is amore efficient and safe alternative. Preventive maintenance means that parts of the engine, such asbearings or shafts, are replaced too early due to fixed maintenance intervals on machines. As a result,terms are shortened unnecessarily, capital is given away. Likewise, this method is not able to detect andaccurately locate defective components before failure. Defective components can cause considerable damage and downtime during machine operation. With condition monitoring or condition-basedmaintenance, both can be realized. Component faults are detected early, and residual storage lives aremaximized. This way costly downtime can be avoided, as well as cost savings through full utilization of theruntimes of critical machine components.

Thanks to intelligent sensor technology, condition-relevantmachine parameters such as machine vibrations, vibrations or temperatures are recorded directly at thesystem during condition monitoring. Using mathematical analysis methods and corresponding software, these parameters can be permanently analyzed. The general machine status as well as individualcomponents can be monitored almost in real time online. The sensors used for the data collection areoften housed in hard-to-access locations, and the sensors may not be accessible through ordinary wiredconnections. As the sensors usually must communicate with upstream data-gathering nodes, wirelesscommunication is required. With the onboard, multistandard 2.4-GHz wireless CC2652 MCU and theCC3220 Wi-Fi MCU, this reference design can support different wireless protocols like Thread, Zigbee®,Bluetooth® low energy (BLE), Wi-Fi® or proprietary solutions.

参考设计TIDA-010012主要特性:

• Dual multi-protocol support with one device
• Wi-Fi® Internet-on-a chip™
• Digital sensor interfaces with integrated protectionfor easy evaluation
• TI SimpleLink™ SDK for CC2652, MSP432, andCC3220 for ease of development

参考设计TIDA-010012应用:

• Factory Automation and Process Control
• Industry 4.0
• Condition Monitoring Sensor
• Condition Monitoring Module
• Condition Monitoring Gateway

图3.参考设计TIDA-010012框图

图4.参考设计TIDA-010012 Wi-Fi和显示模块框图

图5.参考设计TIDA-010012 CC2652模块框图
参考设计TIDA-010012主要系统指标:


参考设计TIDA-010012主要所包含的器件:

• CC3220MODA: SimpleLink™ Wi-Fi CERTIFIED™ wireless module solutions with antenna
• CC2652R: SimpleLink™ multiprotocol 2.4-GHz wireless MCU
• MSP432P4111: SimpleLink™ ultra-low-power 32-bit ARM Cortex-M4F MCU with precision ADC, 2 MBFlash, and 256 KB RAM
• ADS122U04: 24-bit, 2 kSPS, 4-ch, low-power delta-sigma ADC with PGA, Vref, 2 × IDACs, and UARTInterface
• THVD1452: 3.3-V to 5-V RS-485 Transceivers With ±16-kV IEC ESD Protection
• TRS3232E: 3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver With ±15-kV ESD Protection
• ISO1212: Isolated 24-V to 60-V Digital Input Receivers for Digital Input Modules
• HDC2080: Low Power Humidity and Temperature Digital Sensor
• LMR36006: 4.2-V to 60-V, 0.6-A Synchronous Step-Down Converter in HotRod™ Package
• TLV755P: 500-mA low-Iq small-size low-dropout (LDO) regulator
• LMZM23600: 36-V, 0.5-A Step-Down DC/DC Power Module in 3.8-mm × 3-mm Package
• TVS3300: 33-V precision surge protection clamp


图6.参考设计TIDA-010012外形图

图7.参考设计TIDA-010012主板外形图

图8.参考设计TIDA-010012 CC2652适配板外形图

图9.参考设计TIDA-010012电路图(1)

图10.参考设计TIDA-010012电路图(2)

图11.参考设计TIDA-010012电路图(3)

图12.参考设计TIDA-010012电路图(4)

图13.参考设计TIDA-010012电路图(5)

图14.参考设计TIDA-010012电路图(5)

图15.参考设计TIDA-010012电路图(6)

图16.参考设计TIDA-010012电路图(7)

图17.参考设计TIDA-010012电路图(8)

图18.参考设计TIDA-010012电路图(9)

图19.参考设计TIDA-010012电路图(10)
参考设计TIDA-010012材料清单:







图20.参考设计TIDA-010012 PCB设计图(1)

图21.参考设计TIDA-010012 PCB设计图(2)

图22.参考设计TIDA-010012 PCB设计图(3)

图23.参考设计TIDA-010012 PCB设计图(4)

图24.参考设计TIDA-010012 PCB设计图(5)

图25.参考设计TIDA-010012 PCB设计图(6)

图26.参考设计TIDA-010012 PCB设计图(7

图27.参考设计TIDA-010012 PCB设计图(8)

图28.参考设计TIDA-010012 PCB设计图(9)

图29.参考设计TIDA-010012 PCB设计图(10)

图30.参考设计TIDA-010012 PCB设计图(11)

图31.参考设计TIDA-010012 PCB设计图(12)

图32.参考设计TIDA-010012 PCB设计图(13)

图33.参考设计TIDA-010012 PCB设计图(14)

图34.参考设计TIDA-010012 PCB设计图(15)

图35.参考设计TIDA-010012 PCB设计图(16)

图36.参考设计TIDA-010012 PCB设计图(17)

图37.参考设计TIDA-010012 PCB设计图(18)

图38.参考设计TIDA-010012 PCB设计图(19)

图39.参考设计TIDA-010012 PCB设计图(20)

图40.参考设计TIDA-010012 PCB设计图(21)

图41.参考设计TIDA-010012 PCB设计图(22)

图42.参考设计TIDA-010012 PCB设计图(23)

图43.参考设计TIDA-010012 PCB设计图(24)

图44.参考设计TIDA-010012 PCB设计图(25)

图45.参考设计TIDA-010012 PCB设计图(26)

图46.参考设计TIDA-010012 PCB设计图(27)

图47.参考设计TIDA-010012 PCB设计图(28)
详情请见:
http://www.ti.com/lit/ds/symlink/msp432p4111.pdf
http://www.ti.com/lit/ug/tidued5/tidued5.pdf
tidrxz3.zip
tidrxz2.zip
tidrxz5.zip
tidued5.pdf
msp432p4111.pdf

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