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[原创] TI CC2564C双模式蓝牙控制方案

关键词:无线通信 蓝牙 Bluetooth 消费类电子 可穿戴 医疗电子

时间:2017-04-17 10:52:49       作者:TI       来源:中电网

TI公司的CC2564C是完整的蓝牙BR,EDR和低功耗HCI解决方案,基于TI的第七代蓝牙核,提供和Bluetooth 4.2兼容的经过产品验证的解决方案.和MCU一起,HCI器件能提供最好的RF性能和其它低功耗蓝牙解决方案大约两倍的距离,单端50-Ω RF接口.主要用在无线音频解决方案,mPOS,医疗设备,机顶盒(STB),可穿戴设备,传感器集线器和网关,家庭和工厂自动化.本文介绍了CC2564C主要特性,功能框图,参考电路图及其材料清单,开发平台CC256xCQFN-EM主要特性,电路图,材料清单和PCB设计图以及STM3240G-EVAL, CC256X-STADAPT和CC256xCQFN-EM组合连接图.

The TI CC2564C device is a complete Bluetooth® BR, EDR, and low energy HCI solution that reducesdesign effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, theCC2564C device provides a product-proven solution that is Bluetooth 4.2 compliant. When coupled with amicrocontroller unit (MCU), this HCI device offers best-in-class RF performance with about twice the rangeof other Bluetooth low-energy solutions. Furthermore, TI’s power-management hardware and softwarealgorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energymodes of operation.

CC2564C主要特性:

• TI’s Single-Chip Bluetooth® Solution WithBluetooth Basic Rate (BR), Enhanced Data Rate(EDR), and Low Energy (LE) Support
• Bluetooth 4.2 Component Qualified (DeclarationID: D032801); Compliant up to the HCI Layer
• Highly Optimized for Size-Constrained and Low-Cost Designs:
– Single-Ended 50-Ω RF Interface
– Package Footprint: 76 Terminals, 0.6-mm Pitch,8-mm × 8-mm (VQFNP-MR)
• BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three PiconetsSimultaneously, One as Master and Two asSlaves
– Up to Two Synchronous Connection Oriented(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—ContinuouslyVariable Slope Delta (CVSD), A-Law, μ-Law,Modified Subband Coding (mSBC), andTransparent (Uncoded)
– Provide an Assisted Mode for HFP 1.6Wideband Speech (WBS) Profile or A2DPProfile to Reduce Host Processing and Power
– Support of Multiple Bluetooth Profiles WithEnhanced QoS
• Low Energy Features Include:
– Multiple Sniff Instances Tightly Coupled toAchieve Minimum Power Consumption
– Independent Buffering for Low Energy AllowsLarge Numbers of Multiple Connections WithoutAffecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handlingfor BR, EDR, and Low Energy
– Capabilities of Link Layer TopologyScatternet—Can Act Concurrently as Peripheraland Central
– Network Support for up to 10 Devices
– Time Line Optimization Algorithms to AchieveMaximum Channel Utliization
• Best-in-Class Bluetooth (RF) Performance (TXPower, RX Sensitivity, Blocking)
– Class 1 TX Power up to +12 dBm
– Internal Temperature Detection andCompensation to Ensure Minimal Variation inRF Performance Over Temperature, NoExternal Calibration Required
– Improved Adaptive Frequency Hopping (AFH)Algorithm With Minimum Adaptation Time
– Longer Range, Including Twice the Range ofOther Low-Energy-Only Solutions
• Advanced Power Management for ExtendedBattery Life and Ease of Design
– On-Chip Power Management, Including DirectConnection to Battery
– Low Power Consumption for Active, Standby,and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize PowerConsumption
• Physical Interfaces:
– UART Interface With Support for MaximumBluetooth Data Rates
– UART Transport Layer (H4) With MaximumRate of 4 Mbps
– Three-Wire UART Transport Layer (H5) WithMaximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-CodeModulation (PCM)–Inter-IC Sound (I2S) Codec
Interface
• Flexibility for Easy Stack Integration and ValidationInto MCUs and MPUs
• CC256x Bluetooth Hardware Evaluation Tool:PC-Based Application to Evaluate RF Performanceof the Device and Configure Service Pack

CC2564C应用:

• Wireless Audio Solutions
• mPOS
• Medical Devices
• Set-Top Boxes (STBs)
• Wearable Devices
• Sensor Hub, Sensor Gateway
– Home and Factory Automation

图1.CC2564C功能框图

图2.CC2564C参考电路图
CC2564C参考电路材料清单:


开发平台CC256xCQFN-EM

This user’s guide is intended for use with TI’s Bluetooth® development platform, the CC256xCQFN-EMboard. This guide helps users quickly get started integrating the board with TI’s evaluationplatforms and software SDKs. In addition, this user’s guide describes the components and configurationsof the board so that users can quickly get started using it for various Bluetooth applications.

This guide provides information about the module so that developers can use the board specifics to applyit to their applications. Module information and capabilities, including pin descriptions as well as availablesoftware and tools, enhance the user’s out-of-box experience.

图3.开发平台CC256xCQFN-EM主要元件分布图

开发平台CC256xCQFN-EM主要特性:

• Bluetooth specification 4.1/4.2
• Fast time to market
• Easy PCB layout using cadence tools
• 4-layer PCB design
• Bluetooth and Bluetooth low energy
• TI’s Bluetooth royalty-free stack with profiles
• FCC, IC, and Bluetooth SIG compliant
• High sensitivity (–93 dBm typical)
• Shield enabled for immunity
• H4 UART and PCM/I2S interface

开发平台CC256xCQFN-EM主要应用:

The following are example embedded wireless applications:
• Wireless Audio Solutions
• mPOS
• Medical Devices
• Set-Top Boxes (STBs)
• Wearable Devices
• Sensor Hub, Sensor Gateway
– Home and Factory Automation

图4. STM3240G-EVAL, CC256X-STADAPT和CC256xCQFN-EM组合连接图

图5.演示示意图

图6.CC256xCQFN-EM框图

图7.CC256xCQFN-EM电路图(1)

图8.CC256xCQFN-EM电路图(2)

图9.CC256xCQFN-EM电路图(3)

图10.CC256xCQFN-EM PCB设计图(1)

图11.CC256xCQFN-EM PCB设计图(2)

图12.CC256xCQFN-EM PCB设计图(3)

图13.CC256xCQFN-EM PCB设计图(4)

图14.CC256xCQFN-EM PCB设计图(5)

图15.CC256xCQFN-EM PCB设计图(6)
CC256xCQFN-EM材料清单见:
CC256xCQFN-EM材料清单.xls
详情请见:
http://www.ti.com/lit/ds/symlink/cc2564c.pdf
http://www.ti.com/lit/ug/swru493a/swru493a.pdf
以及http://www.ti.com/lit/ug/swru498a/swru498a.pdf
cc2564c.pdf
swru493a.pdf
swru498a.pdf

 

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