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[原创] Microchip BM70低功耗蓝牙(BLE)模块评估方案

关键词:无线通信 蓝牙 低功耗蓝牙 BLE 物联网(IoT) BM70

时间:2015-11-30 10:54:29       作者:Microchip       来源:中电网

microchip公司的BM70/71模块是嵌入应用的蓝牙低功耗解决方案,符合蓝牙V.4.2指标,以增强IoT应用的吞吐量和安全性,纸信标(Beacon)技术以增强用户对IoT的体验,工作频率ISM 2.402GHz-2.480GHz,0-39信道,接收灵敏度-90dBm(LE),发送功率最大为+2dBm,主要用在无联网(IoT),付费/安全,可穿戴设备,家庭和安全,健康健身,信标和工业数据收集等.本文介绍了BM70/71主要特性,系统框图和典型参考电路,以及BM70蓝牙PICtail/PICtail Plus板主要特性,框图和板上主要元件分布图与电路图.

The BM70/71 module offers Bluetooth Low Energysolution for embedded applications. It conforms to theBluetooth core specification version 4.2 to enhance thethroughput and security for the IoT applications. It alsosupports Beacon technology to enhance user experience for the IoT applications and enables users to control the cloud and receive data without opening theapplication through a smart phone.

The BM70/71 integrated Bluetooth stack enablesdevelopers to focus the engineering resources on theapplication, instead of integrating Bluetooth connectivity. The BM70/71 is available in different form factor tooptimize the space, cost, and RF performance. For portable and wearable applications, it provides power-optimized design to minimize the current consumption toextend the battery life.

The BM70/71 embedded 2.4 GHz Bluetooth version 4.2BLE module is built around Microchip TechnologyIS1870/71 BLE SoC (System on Chip). The IS1870/71SoC incorporates Bluetooth stack, power managementsubsystem, 2.4 GHz transceiver, and RF power amplifier.

The user can embed Bluetooth functionality into anyapplications using the BM70/71 module.

The BM70/71 enables faster product development andtime to market. It is designed to provide simple Bluetoothsolutions with the following features:

• Simple integration and programming
• Reduced development time
• Superior wireless module with low-cost system
• Interoperability with Apple® iOS and Android™OS
• Wide range of applications

In addition, the BM70/71 supports Beacon technologyto improve user experiences in IoT applications, suchas auto connection/control and data to cloud.

The BM70/71 can independently maintain a low- powerwireless connection, and the low-power usage and flexiblepower management maximizes the module’s lifetimein battery operated devices. Also, wide operating temperaturerange enables its use in indoor and outdoorenvironments.

The BM70/71 is a small, compact, surface mount on thehost PCB with the castellated pads making the interfaceeasy and reliable. The BM71 is relatively small form factormodule targeted for applications, such as wearablesports, fitness devices and so on.

BM70/71主要特性:

• Bluetooth SIG 4.2 qualified
• Certified to MIC and KCC radio regulations. FCC,IC, and NCC certifications are planned.
• European R&TTE Directive Assessed RadioModule is planned.
• UART, I2C, and SPI interface supported
• Supports transparent UART data service of BLE
• Built around Microchip IS187x SoC
• BM70 supports 3-channel PWM and BM71 supports1-channel PWM
• Precision Temperature Sensor (PTS) withoperating range of -20℃ ~ +70℃ with an
accuracy of +/- 3℃
• 12 bits Analog-to-Digital Converter (ADC) supportfor battery and voltage detection is provided. 8-channel ADC for BM70 and 5-channel ADC forBM71 is provided.
• 18 general purpose I/O pins (BM70) and 9 generalpurpose I/O pins (BM71)
• Integrated 32 MHZ crystal
• Small and compact surface mount module
• Castellated SMT pads for easy and reliable PCBmounting
RF Features
• ISM Band 2.402 GHz to 2.480 GHz operation
• Channels: 0-39
• Receive Sensitivity: typical -90 dBm (LE)
• Transmit Power: Class 2 output power (0 dBmtypical, +2 dBm maximum)
• Received Signal Strength Indication (RSSI)monitor with 1db resolution
MAC/Baseband/Higher Layer Features
• Secure AES128 encryption
• GAP, GATT, SM, L2CAP and integrated publicprofile
• Create custom services using User Interface (UI)tool, a Windows® configuration utility
• I/O capability for BT4.0/BT4.2 authentication
• Software configurable role as peripheral/central,client/server
Antenna
• Integrated chip antenna (BM7xBLES1FC2)
• External antenna connection through RF pad(BM7xBLE01FC2)
Power Management
• Low-power modes supported, system wake-upthrough any GPIO
• Peak current: Tx 13 mA and Rx 13 mA with buckat 3.0V
Operating Conditions
• Operating voltage range: 1.9V to 3.6V
• Operating temperature: -20℃ to 70℃

BM70/71应用:

• Internet of Things (IoT)
• Payment/Security
• Wearable Devices
• Home and Security
• Health and Fitness
• Beacons
• Industrial and Data Logger

图1.BM70系统框图

图2.BM71系统框图

图3.BM70BLES1FC2参考电路

图4.BM70BLE01FC2参考电路

图5.BM71BLE01FC2参考电路

图6.BM71BLES1FC2参考电路

BM70蓝牙PICtail/PICtail Plus板

The BM-70-PICtail/PICtailPlus Board is designed to emulate the function of Microchip’s BM70 BLE module. It also enables the customer to evaluate and demonstrate the capabilities of the BM70 BLE module. The board includes an integrated configuration and programming interface for plug-and-play capability. It also provides an integrated test environment for all functions supported in the BM70 BLE module. The development kit includes the BM70BLES1FC2 module and the BM70BLES1FC2 carrier board.

图7.BM70蓝牙PICtail/PICtail Plus子板外形图

BM70蓝牙PICtail/PICtail Plus板主要特性:

Bluetooth® 4.2 Compliant BM70 module with on-board antenna and 2dBm output power
Develop immediately using the USB interface and Microchip’s Windows-based Configuration Tool PICtail interface for connection to Microchip’s most popular Microcontroller development platforms, such as Explorer16 USB indication, module status and User configurable LEDs Coin cell Battery, USB or PICtail power options Access to all BM70 Module pins。

图8.BM70蓝牙PICtail/PICtail Plus板正面主要元件图

图8中主要装配元件:

1. BM70BLES1FC2 Module.
2. Power Switch Test Button.
3. Serial Flash Interface.
4. USB GPIO interface.
5. USB UART interface.
6. Default LED display.
7. Power Source Connector (Jumper J1).
8. Reset Button.
9. Test buttons (Push-Low).
10. VBAT connector.
11. Test buttons connector (Jumper J7).
12. I2C Interface.
13. DIP Switch SW7.
14. LED test interface.
15. GND test pads.
16. PICtail Interface.

图9.BM70蓝牙PICtail/PICtail Plus板背面主要元件图

图9中主要装配元件

1. USB to UART converter. Switch SW8 is the USB Reset button.
2. Module pads.
3. Provision for coin cell battery

图10.BM70 EVB框图

图11.BM70 EVB电路图(1)

图12.BM70 EVB电路图(2)
详情请见:
http://ww1.microchip.com/downloads/en/DeviceDoc/60001372C.pdf
http://ww1.microchip.com/downloads/en/DeviceDoc/70005235B.pdf
60001372C.pdf
70005235B.pdf

 

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