Freescale KL02 CSP封装超低功耗MCU解决方案

Freescale公司的Kinetis KL02系列是超小型(1.9x2.0x0.56mm)CSP封装基于32位ARM® Cortex™-M0+的MCU,节省了25% PCB面积,而比同类MCU提供多60% GPIO,内核工作频率48MHz,目标应用在低功耗设备,遥控传感节点,手持消费类电子设备和可穿戴设备.本文介绍了Kinetis KL02系列主要特性和框图, 评估板FRDM-KL02Z主要特性和框图与电路图.

The Kinetis KL02 chip-scale package MCU is the world’s smallest ARM-Powered MCU. Available in the ultra-small 1.9 x 2.0 mm wafer-level chip-scale package, the KL02 CSP (MKL02Z32CAF4R) drastically reduces board space while retaining rich MCU feature integration. The KL02 CSP MCU consumes 25 percent less PCB area, yet delivers 60 percent more GPIO than the nearest competing MCU. The KL02 family allows designers to dramatically reduce their board size without compromising the performance, feature integration and power consumption of their end products.

Kinetis KL02系列主要特性:

Ultra Low Power
• Next-generation 32-bit ARM® Cortex™-M0+ core. 2x more CoreMark/ mA than the closest 8/16-bit architecture
• Multiple, flexible low power modes including new compute mode that reduces dynamic power by placing peripherals in an asynchronous stop mode ..

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